MMBF2201NT1【PDF 1/4 页】MOSFET N-CH 20V 300MA SOT-323

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MMBF2201N, NVF2201N

Power MOSFET

300 mAmps, 20 Volts

N ? Channel SC ? 70/SOT ? 323

These miniature surface mount MOSFETs low R DS(on) assure

minimal power loss and conserve energy, making these devices ideal

for use in small power management circuitry. Typical applications are

d c ? d c c o n v e r t e r s , p o w e r m a n a g e m e n t i n p o r t a b l e a n d

battery ? powered products such as computers, printers, PCMCIA

cards, cellular and cordless telephones.

http://onsemi.com

300 mAMPS, 20 VOLTS

R DS(on) = 1 W

Features

? Low R DS(on) Provides Higher Efficiency and Extends Battery Life

? Miniature SC ? 70/SOT ? 323 Surface Mount Package Saves

Board Space

? NVF Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC ? Q101

N ? Channel

Qualified and PPAP Capable*

These Devices are Pb ? Free and are RoHS Compliant

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

Rating Symbol Value

Unit

MARKING DIAGRAM

AND PIN ASSIGNMENT

Drain ? to ? Source Voltage

Gate ? to ? Source Voltage ? Continuous

Drain Current

? Continuous @ T A = 25 ° C

? Continuous @ T A = 70 ° C

? Pulsed Drain Current (t p ≤ 10 m s)

V DSS

V GS

I D

I DM

± 20

300

240

750

Vdc

mAdc

SC ? 70/SOT ? 323

CASE 419

STYLE 8

Drain

N1 M G

Total Power Dissipation @ T A = 25 ° C

(Note 1)

Derate above 25 ° C

Operating and Storage Temperature Range

P D

T J , T stg

150

1.2

? 55 to 150

mW/ ° C

° C

1 2

Gate Source

N1 = Device Code

Thermal Resistance, Junction ? to ? Ambient R q JA 833 ° C/W

Maximum Lead Temperature for Soldering T L 260 ° C

Purposes, for 10 seconds

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Mounted on G10/FR4 glass epoxy board using minimum recommended

footprint.

M = Date Code*

G = Pb ? Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

ORDERING INFORMATION

Device Package Shipping ?

MMBF2201NT1G

NVF2201NT1G*

SOT ? 323

(Pb ? Free)

SOT ? 323

(Pb ? Free)

3000 / Tape &

Reel

3000 / Tape &

Reel

?For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

? Semiconductor Components Industries, LLC, 2013

August, 2013 ? Rev. 7

Publication Order Number:

MMBF2201NT1/D

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